Distortion tolerant pixel design

ABSTRACT

A method of manufacturing a flexible display is provided, which includes depositing a first layer comprising a plurality of thin film transistors (TFTs) on a flexible substrate and depositing a second layer comprising a plurality of pixel electrodes above the first layer with each pixel electrode connected to a respective TFT via a respective via connector between the first and second layers. A display medium responsive to signals on the pixel electrode can be deposited on the second layer for displaying an image on the second layer. A third layer comprising colour filters for filtering an image displayed on the display medium can be aligned to the second layer. The third layer can be deposited and aligned on the second layer such that each colour filter is substantially aligned to a respective pixel electrode to compensate for distortions in the first layer caused by distortions in the flexible substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 12/519,144, having a 371(c) date of Jan. 11, 2010, which is anational phase application of International Application No.PCT/GB2007/050757, filed Dec. 13, 2007, designating the United Statesand published in English on Jun. 19, 2008 as WO 2008/072017, whichclaims priority to United Kingdom Application Nos. 0624994.0, filed Dec.14, 2006, and 0714014.8, filed Jul. 19, 2007.

FIELD OF THE INVENTION

The present invention relates to a pixel architecture for compensatingfor distortions in a flexible substrate and methods of manufacturingdisplays comprising said pixel architectures.

DESCRIPTION OF RELATED ART

Many display technologies such as liquid crystal displays (LCDs) andelectrophoretic displays rely on the use of colour filters to displayfull colour images. Also some emissive display technologies, forexample, organic or inorganic LEDs based on white electroluminescencerely on the use of colour filters to display full colour images. Ingeneral, the display comprises an array of pixels defined by a patternof pixel electrodes through which electrical signals are applied to thedisplay medium. In a passive matrix display each pixel electrode isconnected directly to an interconnect running across the display. In anactive matrix display a thin film transistor (TFT) is used to controlthe voltage signal on the pixel electrode. In a full colour display eachpixel consists of three or more sub-pixels each responsible fordisplaying a specific elementary colour, for example, red, green orblue. In order to achieve a good front-of-screen performance it isnecessary to align the pattern of colour filters with respect to thepattern of pixel electrodes.

Current technology relies on the fabrication of a pixilated colourfilter, which is carefully aligned to the pixels on a backplane. Oncethe colour filters and the pixels are aligned a process of laminatingthe colour filters to the layered substrate then takes place. However,this method of alignment of the colour filter to underlying pixels isnot possible for a device that incorporates a flexible substrate. Thisis due to the level of distortion that is associated with a flexiblesubstrate that occurs during the various processing stages of thesubstrate. In order to achieve optimal colour imaging and maintain highaperture ratio, the colour filter must be very accurately aligned to thepixel pattern on the substrate.

In WO2004/100117, an array of pixels are disclosed, which are arrangedaccording in an irregular array within electronic imaging devices. Inorder to overcome a liasing effect, the pixels are arranged in patternsthat do not easily interact with different patterns within an image.

SUMMARY OF THE INVENTION

We will describe embodiments of the present invention that address theproblem of aligning a pixilated colour filter to a top pixel electrodepattern on a substrate that has been distorted during precedingprocessing steps. The disclosed method incorporates a distortiontolerant pixel design which allows the intentional misalignment of thetop pixel electrode with respect to the source and drain patternedelectrodes by defining a non-distortional top pixel pattern.

The present invention provides a pixel architecture for compensating fordistortions in a flexible substrate of a flexible display, comprising: afirst layer comprising a thin film transistor (TFT) on a flexiblesubstrate; a second layer disposed above said first layer comprising apixel electrode coupled to said TFT for receiving a signal from saidTFT; and a third layer comprising a colour filter for filtering lightdisplayed by said pixel, wherein said third layer is aligned to saidsecond layer such that said colour filter is substantially aligned tosaid pixel electrode, said alignment compensating for distortions insaid first layer caused by distortions in said flexible substrate.

The pixel architecture provides a pixel that compensates for distortionsin a flexible substrate by allowing misalignment of the top pixelelectrode with respect to underlying source-drain patterned electrodes,but aligning the colour filter to the pixel electrode. This enablesarray of such pixels to provide an image of higher quality than wouldotherwise be possible, as the filters are aligned with the electrodes.

In embodiments of the present invention, it is preferable that saidpixel electrode is shaped to enable said pixel electrode to be displacedlaterally with respect to said TFT during manufacture of said pixel,said displacement being caused by distortions in said flexiblesubstrate. Preferably, said coupling between said electrode and TFTcomprises a via connector between said electrode and said TFT.

In embodiments, a maximum lateral displacement between said electrodeand said TFT is less than half of a difference between a dimension ofsaid electrode and a diameter of said via connector.

Preferably, the pixel architecture further comprises a display mediumdisposed between said second and third layers, said display medium beingresponsive to signals on said pixel electrode. In embodiments, saiddisplay medium comprises an electrophoretic display medium or a liquidcrystal medium.

In embodiments, the substrate of the pixel architecture comprisespolyethyleneterephtalate (PET) or polyethylenenaphtalene (PEN). Inembodiments, said TFT comprises an organic semiconductor, which may be asolution-processed organic semiconductor.

The present invention also provides a flexible display comprising: afirst layer comprising a plurality of thin film transistors (TFTs) on aflexible substrate; a second layer disposed above said first layercomprising a plurality of pixel electrodes, each of said pixelelectrodes being coupled to a respective TFT for receiving a signal fromsaid respective TFT; a display medium for displaying an image, saidmedium being disposed on said second layer, and said display mediumbeing responsive to signals on said pixel electrodes; and a third layercomprising a plurality of colour filters for filtering an imagedisplayed on said display, wherein said third layer is aligned to saidsecond layer such that each of said colour filters is substantiallyaligned to a respective pixel electrode, said alignment compensating fordistortions in said first layer caused by distortions in said flexiblesubstrate, and wherein at least some of said pixel electrodes and colourfilters are misaligned with said TFT.

By allowing misalignment of the top pixel with respect to underlyingsource-drain patterned electrodes, but aligning the colour filter to thepixel electrode, the display may provide an image of higher quality thanwould otherwise be possible. The misalignment compensates fordistortions in the underlying flexible substrate.

In embodiments of the present invention, each of said pixel electrodesis shaped to enable said pixel electrodes to be displaced laterally withrespect to said TFTs during manufacture of said display, saiddisplacement being caused by distortions in said flexible substrate.

In embodiments, a lateral position of said via connector relative to asaid pixel electrode varies by at least 5 μm, 10 μm or 20 μm across saidarray.

Preferably, a maximum lateral displacement between a said electrode anda said TFT is less than half of a difference between a dimension of saidelectrode and a diameter of said via connector.

Preferably, the display medium of the flexible display comprises anelectrophoretic display medium or a liquid crystal display medium.Preferably, the substrate of the flexible display comprisespolyethyleneterephtalate (PET) or polyethylenenaphtalene (PEN).Preferably, said TFT of said flexible display comprises an organicsemiconductor, which may be a solution-processed organic semiconductor.

The present invention also provides a method of compensating fordistortion when manufacturing a pixel for a display, the pixelcomprising: a first layer comprising a thin film transistor (TFT) on aflexible substrate; a second layer disposed above said first layercomprising a pixel electrode coupled to said TFT for receiving a signalfrom said TFT; and a third layer comprising a colour filter forfiltering light displayed by said pixel, the method comprising: aligningsaid filter with said electrode and connecting said electrode to saidTFT so as to allow relative misalignment of said electrode and said TFT.

The above method allows misalignment of the top pixel electrode withrespect to underlying source-drain patterned electrodes, but aligningthe colour filter to the pixel electrode. Using such a method, a displaycomprising such pixels may be capable of displaying an image having ahigher quality than may presently be possible.

The present invention also provides a method of manufacturing a flexibledisplay comprising: depositing a first layer comprising a plurality ofthin film transistors (TFTs) on a flexible substrate; depositing asecond layer above said first layer, said second layer comprising aplurality of pixel electrodes, each of said pixel electrodes beingconnected to a respective TFT via a respective via connector betweensaid first and second layers; depositing a display medium for displayingan image on said second layer, said display medium being responsive tosignals on said pixel electrode; aligning a third layer to said secondlayer, said third layer comprising a plurality of colour filters forfiltering an image displayed on said display medium; and depositing saidthird layer on said second layer, wherein said third layer is aligned tosaid second layer such that each of said colour filters is substantiallyaligned to a respective pixel electrode, and wherein said alignmentcompensates for distortions in said first layer caused by distortions insaid flexible substrate.

By allowing misalignment of the top pixel with respect to underlyingsource-drain patterned electrodes, but aligning the colour filter to thepixel electrode, a display manufactured using this method may provide animage of higher quality than would otherwise be possible. Themisalignment compensates for distortions in the underlying flexiblesubstrate.

In embodiments, depositing a second layer in the method of manufacturinga flexible display comprises depositing a conductive material on saidfirst layer; and patterning said conductive material to define saidplurality of pixel electrodes, and wherein said pixel electrodes areshaped to enable said pixel electrodes and said TFTs to be displacedlaterally from one another, said displacement being caused bydistortions in said flexible substrate. Preferably, a maximum lateraldisplacement is less than half of a difference between a dimension ofsaid electrode and a diameter of said via connector.

Preferably, depositing a third layer comprises: depositing a filteringmaterial on said display medium; and patterning said filtering materialto define said plurality of colour filters, each of said colour filtersbeing substantially aligned to a respective pixel electrode.

Preferably, the step of patterning comprises performing a step andrepeat exposure procedure comprising exposing a first area of said layerto a light source to define a pattern, and translating said substratefrom a first position at which said first area is exposable to a secondposition at which a second area of said layer is exposable. Preferably,a distance between said first position and said second position is aninteger multiple of a pitch of said pixel electrodes. Furthermore, adistance between said first and said second position may be selected tocorrect for distortion in said first layer caused by distortion in saidflexible substrate.

In embodiments, said light source is a laser and wherein said materialis laser ablated. Alternatively, said exposure comprises aphotolithographic process. Alternatively, said material is deposited andpatterned substantially at the same time by printing said material in apattern onto said layer.

Preferably, the step of aligning comprises aligning features in saidthird layer to corresponding features in said second layer. Preferably,said features include layer markers disposed in one or more corners ofsaid layer.

In embodiments, aligning comprises measuring and storing positioningdata representing a position of said display during said deposition ofsaid second layer; and controlling a position of said display duringsaid depositing of said third layer using said data.

In embodiments of the method of manufacturing a flexible display, saiddisplay medium comprises an electrophoretic display medium or a liquidcrystal medium. Preferably, said substrate comprisespolyethyleneterephtalate (PET) or polyethylenenaphtalene (PEN).Preferably, said TFT comprises an organic semiconductor, which may be asolution-processed organic semiconductor.

The present invention also provides a pixel for a flexible display,comprising: a first layer comprising a thin film transistor (TFT) on aflexible substrate; and a second layer disposed above said first layercomprising a pixel electrode coupled to said TFT for receiving a signalfrom said TFT, wherein said pixel electrode is shaped to enable saidpixel electrode to be displaced laterally with respect to said TFTduring manufacture of said pixel, said displacement being caused bydistortions in said flexible substrate.

Preferably, said coupling between said electrode and TFT comprises a viaconnector between said pixel electrode and said TFT. Preferably, amaximum lateral displacement between said electrode and said TFT is lessthan half of a difference between a dimension of said electrode and adiameter of said via connector.

In embodiments, the pixel for a flexible display further comprises: athird layer comprising a colour filter for filtering light displayed bysaid pixel, wherein said third layer is aligned to said second layersuch that said colour filter is substantially aligned to said pixelelectrode, and wherein said alignment compensates for distortions insaid first layer caused by distortions in said flexible substrate.

Preferably, a display medium is disposed between said second and thirdlayers, said display medium being responsive to signals on said pixelelectrode. Preferably, said display medium comprises an electrophoreticdisplay medium or a liquid crystal medium. Preferably, said substratecomprises polyethyleneterephtalate (PET) or polyethylenenaphtalene(PEN). Preferably, said TFT comprises an organic semiconductor, whichmay be a solution-processed organic semiconductor.

According to another embodiment of the present invention, anarchitecture is disclosed for a full-colour active matrix pixilateddisplay on a flexible substrate comprising an array of TFTs on a firstlevel, an array of pixel electrodes on a second level each connected toan electrode of a TFT by a via-hole interconnection and an array ofcolour filters on a third level, wherein the position of the via holeinterconnection in each sub-pixel with respect to the corresponding TFT,and/or pixel electrode varies across the array due to distortion in theunderlying substrate. The invention allows forming the pixel electrodesand colour filters as periodic or quasiperiodic arrays with highaccuracy and high relative alignment, while ensuring that each TFT onthe flexible substrate is connected to the correct sub-pixel electrode.

The present invention addresses the problem of visual image artifactsthat arise when patterning colour filter arrays on flexible activematrix substrates. When manufacturing the array of TFTs on a flexibleactive matrix substrate it is preferable to align accurately the gateelectrodes of the TFT with respect to the source-drain electrodes acrossthe array in order to avoid variations in the parasitic capacitancebetween source-drain and gate electrodes across the array. This requirescompensating for distortions of the substrate when patterning the gateelectrode array on top of an underlying source-drain array (top-gateconfiguration) and source-drain array on top of an underlying gate array(bottom-gate configuration), respectively. These distortions might occurin between the steps of processing the gate and source-drain electrodelayer, for example as a result of temperature variations, mechanicalhandling of the substrate or exposure to chemical agents, such as watervapour.

As a result of the substrate distortion the position of the TFTs is notperiodic across the array. If the array of pixel electrodes and colourfilters were aligned to be at a fixed position with respect to each ofthe TFTs, as is desirable in conventional configuration in which thepixel electrode is defined on the same level as the source-drain andgate electrodes, respectively, this would lead to visual imageartifacts, since the human eye is very sensitive to spatial variationsin the pitch of a quasi-periodic array. Also, any misalignment of thepixel electrode and the colour filter pixel can lead to image artifactssuch as colour filters spatially overlapping with pixel electrodesbelonging to neighbouring pixels/sub-pixels.

The architecture according to the present invention addresses thisproblem by allowing the position of the pixel TFT with respect to thepixel electrode and colour filter, to vary respectively. By forming thepixel electrode on a different level of the device than the TFTs thepresent invention allows maintaining accurate alignment of thesource-drain and gate electrodes of the TFT with respect to each otherin the presence of substrate distortions while forming the pixelelectrodes and colour filter pixels on a periodic or quasi-periodicarray with high accuracy and in accurate relative alignment.

According to another embodiment of the present invention a method isdisclosed for fabricating a full-colour active matrix pixilated displayon a flexible substrate comprising an array of TFTs on a first level, anarray of pixel electrodes on a second level each connected to anelectrode of a TFT by a via-hole interconnection and an array of colourfilters on a third level wherein the position of the via holeinterconnection in each sub-pixel with respect to the corresponding TFT,and/or pixel electrode varies across the array due to distortion in theunderlying substrate.

According to a preferred embodiment of this aspect of the invention thetechnique for patterning the array of pixel electrodes and colour filterpixels is step-and-repeat exposure of the substrate to a shaped beam oflight or laser radiation. Patterning is achieved either by the processof laser ablation or by light-induced chemical or physical changes of amaterial on the substrate.

If the maximum distortion of the array of TFTs is smaller than acritical distortion x_(c), which denotes the maximum allowabledistortion for which each via-hole interconnection remains connected tothe correct sub-pixel electrode (the array of pixel electrodes beingperiodic across the entire substrate), the step-and-repeat exposurepreferably involves exposing the substrate to a periodic pattern oflight with a defined pixel pitch and translating the substrate betweensubsequent exposures by a fixed translation distance that is an integermultiple of said pixel pitch. Preferably, for the patterning of thepixel electrodes and of the colour filter pixels the same pixel pitchand the same fixed translation distance are used. The pattern of colourfilter pixels is preferably aligned with respect to the pattern of pixelelectrodes by using a set of global alignment marks defined on the levelof the pixel electrodes.

If the maximum distortion of the array of TFTs are larger than acritical distortion x_(c), which denotes the maximum allowabledistortion of the TFT array for which each via-hole interconnectionremains connected to the correct sub-pixel electrode (the array of pixelelectrodes being periodic across the entire substrate), thestep-and-repeat exposure preferably involves exposing the substrate to apattern of light and translating the substrate between subsequentexposures by a variable distance that is selected to ensure that in eachof the exposed areas each via-hole interconnection would remainconnected to the correct sub-pixel electrode.

According to one embodiment of this aspect of the invention the patternof each step-and-repeat light exposure is periodic and the correctionfor the distortion of the array of TFTs is achieved solely by varyingthe translation distance by which the substrate is translated in betweensubsequent exposures. Preferably, for the patterning of the pixelelectrodes and of the colour filter pixels the same pixel pitch and thesame set of translation distances are used. The pattern of colour filterpixels is preferably aligned with respect to the pattern of pixelelectrodes by using a set of global alignment marks defined on the levelof the pixel electrodes.

According to another embodiment of this aspect of the invention thepattern of each step-and-repeat light exposure is non-periodic and thecorrection for the distortion of the array of TFTs is achieved byvarying the distance by which the substrate is translated in betweensubsequent exposures, and by selecting a set of variable pixel distancesin each step-and-repeat light exposure pattern in such a way that visualimage artifacts at the boundaries between subsequent light-exposures areminimized. Preferably, for the patterning of the pixel electrodes and ofthe colour filter pixels the same set of pixel distances and translationdistances are used. The pattern of colour filter pixels is preferablyaligned with respect to the pattern of pixel electrodes by using a setof global alignment marks defined on the level of the pixel electrodes.

BRIEF DESCRIPTION OF THE DRAWINGS

To help understanding of the invention, a specific embodiment thereofwill now be described by way of example and with reference to theaccompanying drawings, in which:

FIG. 1 shows the process of forming a monochrome display incorporating abackplane with a pixel electrode array and display medium.

FIG. 2 illustrate a schematic diagram of a colour display incorporatinga backplane with a pixel electrode array, a display medium and apixilated colour filter on an undistorted substrate.

FIG. 3 shows a schematic diagram of a colour display incorporating abackplane with a pixel electrode array, a display medium and a pixilatedcolour filter on a distorted substrate, wherein the colour filter arrayhas not been aligned with respect to the underlying pixel electrodearray.

FIG. 4 shows a schematic diagram of a colour display incorporating abackplane with a pixel electrode array, a display medium and a pixilatedcolour filter on a distorted substrate, wherein the colour filter arrayhas been aligned with respect to the underlying pixel electrode arrayaccording to the present invention.

FIG. 5 shows a top view of an electronic device incorporating a toppixel electrode and a colour filter on an undistorted substrate that iscorrectly aligned according to the present invention.

FIG. 6 shows an electronic device incorporating a top pixel electrodedeposited onto a distorted substrate that is intentionally misaligned.

FIG. 7 shows the substrate markers on the edge of the substrate.

FIG. 8 illustrates an electronic device incorporating a top pixelelectrode deposited onto a distorted substrate where the colour filterhas been aligned to the top pixel electrode.

FIG. 9 shows the level of tolerable distortion for both a via hole fromthe centre of a top pixel and also of a pixel electrode on a substratesurface.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Example: A method of processing colour filters on a flexible displaydevice by overcoming substrate distortion.

A preferred embodiment is disclosed according to the present invention,wherein a flexible electronic device is formed by a process in which acolour filter array is deposited over a layer of display media using amethod of alignment to an underlying array of top pixel electrodes. Thisprocess of aligning the above said colour filter to the positioning ofthe top pixel electrode allows compensating for the distortioncorrection of a distorted flexible substrate.

According to a main embodiment of the present invention, FIG. 1 showsthe formation of the various layers of a multi-layered substrate stack.Conductive material is deposited and patterned on a substrate 1 to formsource and drain electrodes 2, 3. The substrate may be either glass or apolymer film, but preferably a plastic substrate such aspolyethyleneterephtalate (PET) or polyethylenenaphtalene (PEN) is used.The patterned conductive layer 2, 3 comprises a conducting polymer, suchas PEDOT, or a metallic material, such as gold or silver. It may bedeposited and patterned by techniques, such as, but not limited toadditive solution processing, for example, spin, dip, blade, bar,slot-die, or spray coating, inkjet, gravure, offset or screen printing,or vacuum-base deposition such as evaporation or sputtering followed bysubtractive patterning, such as photolithography and laser ablation.

Once the conductive layer has been patterned to form the source anddrain electrodes, a layer of semiconducting material 4 may then bedeposited over the substrate and patterned electrodes. Thesemiconducting layer may be either an organic or an inorganic material,but preferably consist of a conjugated organic semiconductor such as,but not limited to, pentacene, polyarylamine, polyfluorene orpolythiophene derivatives. A broad range of printing techniques may beused to deposit the semiconducting material including, but not limitedto, inkjet printing, soft lithographic printing (J. A. Rogers et al.,Appl. Phys. Lett. 75, 1010 (1999); S. Brittain et al., Physics World May1998, p. 31), screen printing (Z. Bao, et al., Chem. Mat. 9, 12999(1997)), and photolithographic patterning (see WO 99/10939), offsetprinting, blade coating or dip coating, curtain coating, meniscuscoating, spray coating, or extrusion coating.

A layer of gate dielectric material 5 is then deposited onto the layeredsubstrate. Any organic or inorganic dielectric may be used, however incombination with a semiconducting polymer polymer dielectrics such assuch as polyisobutylene, polyvinylphenol, polymethylmethacrylate (PMMA)or polystyrene are preferred. The dielectric material may be depositedin the form of a continuous layer, by techniques such as, but notlimited to, spray or blade coating. However, preferably, the techniqueof spray coating is used.

The deposition of the dielectric layer is then followed by thedeposition and patterning of a gate electrode and interconnect lines 6.The material of the gate electrode may be a patterned thin film ofinorganic metals such as gold or a pattern of printable inorganicnanoparticles of silver or gold, or a conducting polymer, such aspolyethylenedioxythiophene doped with polystyrene sulfonic acid(PEDOT/PSS). The gate electrode is deposited using techniques such assputtering or evaporation techniques or solution processing techniquessuch as, but not limited to, spin, dip, blade, bar, slot-die, gravure,offset or screen printing. Preferably, the gate electrode is depositedusing the solution processing technique of ink jet printing.Alternatively, the gate electrode may be patterned by techniques such asphotolithographic patterning (WO 99/10939) or laser ablation.

Other low-cost patterning techniques can also be used to pattern thegate electrode and interconnect lines, such as subtractive patterning byphotolithography or laser ablation patterning. A particularly preferredpatterning technique is selective laser ablation patterning (SLAP) (asexplained in patent application number GB0513915.9). The technique ofSLAP is a method of producing fine features of a device using shortpulse lasers for the fabrication of thin film transistor (TFT)structures. This technique incorporating laser ablation uses a singleshot per imaging area of a short pulse laser to pattern layers ofmetallic material on top of underlying layers in order to produce finefeatures of a TFT device. An example is the patterning of a gold gateelectrode of a top-gate organic TFT with underlying gate dielectric,active semiconductor and conducting source-drain electrode layers. Thistechnique may be performed without destroying or substantially degradingthe performance of these sensitive elements, such as the semiconductorlayer and the source-drain electrodes. This is due to the short pulselength allowing all of the energy of an ultra-short laser beam to enterthe material and to be absorbed within the layer to be ablated whichwill result in the act of ablation before any substantial thermalizationactually occurs, that can lead to degradation/ablation of underlyinglayer. This technique can be employed for patterning of metal electrodesand interconnects on the various levels of the device, in particular forpatterning of the source-drain and gate electrodes, and the commonelectrode layer.

At least one further layer of dielectric material 5 is deposited on thesubstrate after the deposition of the gate electrode and interconnectand data lines. The dielectric material may be deposited from solutionin the form of a continuous layer, by techniques such as, but notlimited to, spin coating, ink-jet printing, spray-coating, rollercoating spray or blade coating. The dielectric material may also bedeposited using vapour phase deposition techniques like evaporation orchemical vapour deposition. The dielectric material is preferablydeposited in such a way so that no degradation occurs to the underlyinglayers. A method to achieve this is disclosed in our previous patentapplication WO01/47043. In this, a method for forming a transistor wasdisclosed by depositing a first material from solution in a firstsolvent to form a first layer of the transistor; and subsequently whilstthe first material remains soluble in the first solvent, forming asecond layer of the transistor by depositing over the first material asecond material from solution in a second solvent in which the firstmaterial is substantially insoluble. A suitable solution processabledielectric material that may be used as a second dielectric layer ispolystyrene dissolved in xylene. In addition, parylene is an example ofa dielectric material that may be deposited via chemical vapour phasedeposition.

Then a via-hole interconnection 7 through the dielectric later 5 to theunderlying drain electrode 3. Techniques for via hole opening 7 and viafabrication, and other selective connection formation techniques such asselective removal of layers, are described at pages 32 to 39 of WO01/47043, with reference to FIGS. 12 to 15, which material isspecifically incorporated by reference in this application.

A conductive material, such as a conducting polymer is deposited intothe via hole to form an electrical connection between the underlyingdrain electrode and the top pixel, which is formed at the same time asfilling the via hole 8, as is shown in FIG. 1 b).

A top level pixel electrode is deposited (as shown in FIG. 1 b) as apatterned film using a direct write printing technique such as inkjetprinting of a conducting polymer. The pixel electrode is required to beelectrically connected to the underlying drain electrode 3 of the TFTthrough a via hole interconnection 8 (see FIG. 1 b).

A display medium 10 is then deposited and laminated over the underlyingpatterned conductive top pixel electrode layer as in shown in FIG. 1 c).Preferably, an emissive (light-emitting) display or a reflective ortransmissive display medium, such as an electrophoretic display mediumor a reflective or transmissive LC medium is incorporated within thedevice structure and is located over the underlying back plane. Thedisplay medium is deposited directly and continuously over the flexibleback plane substrate. Preferably, the display medium is a reflective oremissive display medium, since in this case the present architecture inwhich the pixel electrode is formed on a different level than the TFTallows achieving high aperture ratio irrespective of the size of theTFT. For example, in the case of a polymer light-emitting display mediumthe optically active polymers may be solution-coated or inkjet printedabove the top pixel locations of an active or passive matrix followed bya transparent encapsulation layer. In the case of an electrophoreticdisplay medium a film of electrophoretic ink deposited onto a topsubstrate of the flexible back plane.

Finally, colour filters 11 are laminated on top of the underlying mediadisplay layer as is seen in FIG. 2. The colour filters may be depositedand patterned through solution processing techniques such as, but notlimited to, spin-coating a negative photo-resist and then patterning thefilters by photolithography and subsequent etching. Alternatively, thecolour filter material may be deposited by direct-write techniques suchas ink jet printing. If the substrate is a rigid substrate in which thepattern of pixel electrodes 9 is arranged on a regular pitch across thewhole substrate, the colour filter array can be aligned accurately byusing the same pitch pattern for the patterning of the colour filter.The layered device structure incorporating the colour filters accordingto the prior art can be seen in FIG. 2.

FIG. 3 shows a distorted substrate where the position of the top pixelelectrode has been aligned accurately with respect to thesource/drain/gate pattern of the TFT. If the TFT array is distorted dueto distortion of the dimensionally unstable substrate during processing,and the colour filter array is patterned on a periodic array accordingto the method in the prior art the colour filter of a particular pixelis deposited partly over the top pixel electrode of a neighbouringdevice leading to overlap areas 12 and associated image artifacts.

In contrast, the effect of employing the present invention isillustrated in FIG. 4. It can be seen that the top pixel electrode inFIG. 4 has been intentionally misaligned with respect to thesource/drain/gate pattern of the TFT array. For example, the array ofpixel electrodes is defined on a regular, periodic or quasi-periodicgrid irrespective of the distortion of the underlying TFT array. Thecolour filters are then aligned to the top pixel, by patterning thecolour filter array on the same regular, periodic or quasi-periodicgrid, therefore enabling the colour filter and the top pixel electrodeto be exactly aligned to each other.

A top view of the device is seen in FIG. 5 showing the overlying toppixel electrode 14 and the via hole 13 that electrically connects thetop pixel electrode to the underlying drain pad 16 of the TFT (withsource electrode 15).

As can be seen in FIG. 6, as a result of the various precedingprocessing stages, a flexible substrate will suffer from distortion. Inorder to accommodate a flexible substrate, the top pixel pattern is ableto be distortion corrected to align with the source and drain pattern onthe substrate. This would result in a distorted top pixel pattern andmake alignment with a pixilated colour filter impossible. The top pixelelectrode layer is deposited such that it is mis-aligned in relation tothe underlying elements of the device. However, mis-alignment of the toppixel electrode to the underlying device elements will not affect theperformance of the device in itself. It will lead to variations of theposition the via-hole interconnect 13 within the pixel electrode 14,however, this does not affect device performance as long as thedistortion of the TFT array is sufficiently small that the via-holeremains within the area of the respective pixel electrode withoutconnecting to a neighbouring pixel electrode. It is desirable for gooddevice performance that the overlying colour filter of the device isaligned to the top pixel electrode. Therefore, after the deposition ofthe display media, the positioning of the top pixel electrode isremembered and stored and the overlying colour filter is aligned to theposition of the pixel electrode. The result will be that both the toppixel electrode and the colour filter will be mis-aligned in relation tothe underlying features of the device, but this will not affect theperformance of the device.

The alignment of the colour filter to the top pixel electrode may beachieved in a number of ways. The data representing the positioning ofthe top pixel electrode may be stored and then used to self-align theoverlying colour filter to the top pixel electrode. Alternatively, thesubstrate markers may be used to locate the position of the top pixelelectrode and then used to self-aligned the colour filter to it, as isshown in FIG. 7, with the substrate markers 17 located at each corner ofthe substrate.

If the array of pixel electrodes and colour filters were aligned to beat a fixed position with respect to each of the TFTs, as is the case inconventional configuration in which the pixel electrode is defined onthe same level as the source-drain and gate electrodes, respectively,this would lead to visual image artifacts, since the human eye is verysensitive to spatial variations in the pitch of a quasi-periodic array.Also, any misalignment of the pixel electrode and the colour filterpixel can lead to image artifacts such as colour filters spatiallyoverlapping with pixel electrodes belonging to neighbouringpixels/sub-pixels.

The architecture according to the present invention addresses thisproblem by allowing to vary the position of the pixel TFT with respectto the pixel electrode and colour filter, respectively. By forming thepixel electrode on a different level of the device than the TFTs thepresent invention allows maintaining accurate alignment of thesource-drain and gate electrodes of the TFT with respect to each otherin the presence of substrate distortions while forming the pixelelectrodes and colour filter pixels on a periodic or quasi-periodicarray with high accuracy and in accurate relative alignment.

FIG. 8 shows a device structure where a colour filter has beenself-aligned to the underlying pixel electrode.

In the example discussed within the first embodiment, where the toppixel electrode is not aligned such as to be at a fixed position withrespect to the TFT, there is a maximum level of distortion that can betolerated by simply using a periodic step and repeat patterning processto define the top pixel electrode pattern.

The maximum allowable distortion for periodic patterning is defined bythe diameter of the via and the dimensions of the pixel. As long as thedistortion does not cause the via to move outside the perimeter of thepixel electrode, then the top pixel electrode pattern can be defined bya simple step and repeat patterning technique where the pixel pattern istranslated by an integer multiple of the pixel dimension.

This is further explained graphically in FIG. 9, where the pixel has thedimensions x and y, and the via diameter is Z. The position of the viais held at a fixed position relative to the TFT (which is actuallymoving due to distortion), and the top pixel electrode pattern isallowed to remain static. This technique works well as long as themaximum distortion on the active area is less that (Z−x)/2 in the xdirection and (Z−y)/2 in the y direction. The top pixel pattern in thiscase can be defined as a regularly repeating periodic pattern.

Preferably, the patterning of the pixel electrode and colour filterarray involve exposing the substrate to a periodic pattern of light witha defined pixel pitch and translating the substrate between subsequentexposures by a fixed translation distance that is an integer multiple ofsaid pixel pitch. The step-and-repeat exposure might involvephotolithographic patterning or laser ablation of the pixel electrodeand colour filter materials. Preferably, for the patterning of the pixelelectrodes and of the colour filter pixels the same pixel pitch and thesame fixed translation distance which is an integer multiple of thepixel pitch are used. The pattern of colour filter pixels is preferablyaligned with respect to the pattern of pixel electrodes by using a setof global alignment marks defined on the level of the pixel electrodes.

As soon as the distortion is greater than this maximum distortion value,the via will be connecting to more than one top pixel electrode.

In this case, where the maximum distortion is greater than (Z−x)/2 inthe x direction or (Z−y)/2 in the y direction, a simple periodicrepeating pattern will not allow for each pixel on the display to makecontact through only a single via. Therefore, local alignment must beemployed and the top pixel pattern must be adjusted across the displayto accommodate this. The result is a non-periodic pattern. Localdistortion correction is the only method that will be successful indefining the top pixel and colour filter pattern such that eachsub-pixel is correctly aligned. However, even in this case thedeviations of the colour filter array from a perfectly periodic arraycan be kept to a minimum by allowing the position of the via holeinterconnect to vary within the area of the pixel electrode.

Preferably, the patterning of the pixel electrode and colour filterarray involve a step-and-repeat exposure which exposes the substrate toa pattern of light in an exposure area and translates the substratebetween subsequent exposures by a variable distance that is selected toensure that in each of the exposed areas each via-hole interconnectionremains connected to the correct sub-pixel electrode.

The pattern of each step-and-repeat light exposure is preferablyperiodic and the correction for the distortion of the array of TFTs maybe achieved solely by varying the translation distance by which thesubstrate is translated in between subsequent exposures for patterningof the pixel electrodes. Preferably, for the patterning of the pixelelectrodes and of the colour filter pixels the same pixel pitch and thesame set of translation distances are used. The pattern of colour filterpixels is preferably aligned with respect to the pattern of pixelelectrodes by using a set of global alignment marks defined on the levelof the pixel electrodes.

According to another embodiment of this aspect of the invention thepattern of each step-and-repeat light exposure is non-periodic and thecorrection for the distortion of the array of TFTs is achieved byvarying the distance by which the substrate is translated in betweensubsequent exposures, and by selecting a set of variable pixel distancesin each step-and-repeat light exposure pattern in such a way that visualimage artifacts at the boundaries between subsequent light-exposures areminimized. Preferably, for the patterning of the pixel electrodes and ofthe colour filter pixels the same set of pixel distances and translationdistances are used. The pattern of colour filter pixels is preferablyaligned with respect to the pattern of pixel electrodes by using a setof global alignment marks defined on the level of the pixel electrodes.

The patterning of the colour filter array may consist of three or moreindividual patterning steps, and the above applies to each of the threeor more patterning steps.

For the patterning of the pixel electrodes and colour filter arraytechniques other than step-and-repeat light exposure, such as directprinting, conventional photolithography, imprinting or any otherpatterning technique may be used.

For the TFT, configurations other than top-gate architectures might beused, such as bottom-gate TFT structure with the pixel electrode beinglocated on a level different from that on which the source and drainelectrodes are formed. The invention also applies to passive matrixdisplays in which the pixel electrode and colour filter arrays need tobe formed on top of an array of addressing interconnects.

The present invention is not limited to the foregoing examples. Aspectsof the present invention include all novel and inventive aspects of theconcepts described herein and all novel and inventive combinations ofthe features described herein.

For the semiconducting layer any vacuum or solution processableconjugated polymeric or oligomeric material that exhibits adequatefield-effect mobilities exceeding 10-3 cm2/Vs, preferably exceeding 10-2cm2/Vs, may be used. Suitable materials are reviewed for example in H.E. Katz, J. Mater. Chem. 7, 369 (1997), or Z. Bao, Advanced Materials12, 227 (2000). Other possibilities include small conjugated moleculeswith solubilising side chains (J. G. Laquindanum, et al., J. Am. Chem.Soc. 120, 664 (1998)), semiconducting organic-inorganic hybrid materialsself-assembled from solution (C. R. Kagan, et al., Science 286, 946(1999)), or solution-deposited inorganic semiconductors such as CdSenano-particles (B. A. Ridley, et al., Science 286, 746 (1999)) orinorganic semiconductor nano-wires (X. Duan, Nature 425, 274 (2003)).

The structures described above could be supplemented by other conductiveand/or semiconductive structures on the same substrate, for exampleinterconnects. Multiple structures as described above may be formed onthe same substrate, and may be connected together by electricallyconductive interconnects to form an integrated circuit.

The applicant hereby discloses in isolation each individual featuredescribed herein and any combination of two or more such features, tothe extent that such features or combinations are capable of beingcarried out based on the present specification as a whole in the lightof the common general knowledge of a person skilled in the art,irrespective of whether such features or combinations of features solveany problems disclosed herein, and without limitation to the scope ofthe claims. The applicant indicates that aspects of the presentinvention may consist of any such individual feature or combination offeatures. In view of the foregoing description it will be evident to aperson skilled in the art that various modifications may be made withinthe scope of the invention.

What is claimed is:
 1. A method of manufacturing a flexible displaycomprising: depositing a first layer comprising a plurality of thin filmtransistors (TFTs) on a flexible substrate; depositing a second layerabove said first layer, said second layer comprising a plurality ofpixel electrodes, each of said pixel electrodes being connected to arespective TFT via a respective via connector between said first andsecond layers; depositing a display medium for displaying an image onsaid second layer, said display medium being responsive to signals onsaid pixel electrode; aligning a third layer to said second layer, saidthird layer comprising a plurality of colour filters for filtering animage displayed on said display medium; and depositing said third layeron said second layer, wherein said third layer is aligned to said secondlayer such that each of said colour filters is substantially aligned toa respective pixel electrode, and wherein said alignment compensates fordistortions in said first layer caused by distortions in said flexiblesubstrate.
 2. A method according to claim 1, wherein depositing a secondlayer comprises: depositing a conductive material on said first layer;and patterning said conductive material to define said plurality ofpixel electrodes, and wherein said pixel electrodes are shaped to enablesaid pixel electrodes and said TFTs to be displaced laterally from oneanother, said displacement being caused by distortions in said flexiblesubstrate.
 3. A method according to claim 2, wherein a maximum lateraldisplacement is less than half of a difference between a dimension ofsaid electrode and a diameter of said via connector.
 4. A methodaccording to claim 1, wherein depositing a third layer comprises:depositing a filtering material on said display medium; and patterningsaid filtering material to define said plurality of colour filters, eachof said colour filters being substantially aligned to a respective pixelelectrode.
 5. A method according to claim 2, wherein patterningcomprises performing a step and repeat exposure procedure comprisingexposing a first area of said layer to a light source to define apattern, and translating said substrate from a first position at whichsaid first area is exposable to a second position at which a second areaof said layer is exposable.
 6. A method according to claim 5, wherein adistance between said first position and said second position is aninteger multiple of a pitch of said pixel electrodes.
 7. A methodaccording to claim 5, wherein a distance between said first and saidsecond position is selected to correct for distortion in said firstlayer caused by distortion in said flexible substrate.
 8. A methodaccording to claim 5, wherein said light source is a laser and whereinsaid material is laser ablated.
 9. A method according to claim 5,wherein said exposure comprises a photolithographic process.
 10. Amethod according to claim 2, wherein said material is deposited andpatterned substantially at the same time by printing said material in apattern onto said layer.
 11. A method according to claim 1, whereinaligning comprises aligning features in said third layer tocorresponding features in said second layer.
 12. A method according toclaim 11, wherein said features include layer markers disposed in one ormore corners of said layer.
 13. A method according to claim 1, whereinaligning comprises measuring and storing positioning data representing aposition of said display during said deposition of said second layer;and controlling a position of said display during said depositing ofsaid third layer using said data.
 14. A method according to claim 1,wherein said display medium comprises an electrophoretic display medium.15. A method according to claim 1, wherein said display medium comprisesa liquid crystal medium.
 16. A method according to claim 1, wherein saidsubstrate comprises polyethyleneterephtalate (PET) orpolyethylenenaphtalene (PEN).
 17. A method according to claim 1, whereinsaid TFT comprises an organic semiconductor.
 18. A method according toclaim 17, wherein said organic semiconductor is a solution-processedorganic semiconductor.